12μ M - 100μ M Treated Ra Cu Foil for PCB

Product Details
Customization: Available
Type: Copper Foil
Application: Lithium Battery/Flexiable Circuit/Transformer
Manufacturer/Factory, Trading Company
Diamond Member Since 2018

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  • 12μ M - 100μ M Treated Ra Cu Foil for PCB
  • 12μ M - 100μ M Treated Ra Cu Foil for PCB
  • 12μ M - 100μ M Treated Ra Cu Foil for PCB
  • 12μ M - 100μ M Treated Ra Cu Foil for PCB
  • 12μ M - 100μ M Treated Ra Cu Foil for PCB
  • 12μ M - 100μ M Treated Ra Cu Foil for PCB
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Basic Info.

Model NO.
Cu Foil
Material
Purple Copper
Shape
Foil
Alloy
Non-alloy
Color
Red
Standard
GB/T
Width Range
0.16inch~24inch (4mm-600mm) 
Thickness Range
0.0004inch~0.006inch (0.01mm-0.15)
Performance
Metallographic
Density
8.9g/cm3 
Softening Temperature
≥380°c
Elastic Modulus
118000n/M 
Thermal Conductivity (20°c)
390W/(M°c) 
Transport Package
Base on Customers Requirement
Specification
Customzied
Trademark
Allotech
Origin
China
HS Code
7410121000
Production Capacity
50 Tons Every Month

Product Description

Rolled Copper Foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. 

Base Material: C11000 Copper, Cu > 99.90% 
Thickness Range: 0.0004inch~0.006inch (0.01mm-0.15mm) 
Width Range: 0.16inch~24inch (4mm-600mm) 
Temper: Hard, Quarter Hard, Half Hard, Soft 
Application: Transformer, Copper Flexible Connector, CCL, FCCL, PCB, Geothermal Film, Construction, Decoration etc.

GB ALLOY NO. SIZE (mm)
(ISO) (ASMT) (JIS) (BIS) (DIN)
T2 Cu-ETP C11000 C1100 C101 R-Cu57 Thickness: 0.01-0.15/Max Width: 600
TU2 Cu-OF C10200 C1020 Cu-OFC OF-Cu

 Mechanical Properties
Temper JIS Temper Tensile Strength Rm/N/mm 2 Elongation A50/% Hardness HV
M O 220~275 ≥ 15 50~70
Y4 1/4H 240~300 ≥ 9 65~85
Y H 330~450 - 100~140
T EH 380~510 - -
Note: We can provide products with other properties according to customers` requirements.

Physical Properties 
Density: 8.9g/cm3 
Electrical conductivity (20°C): min 90%IACS for annealed to temper 
                                            min 80%IACS for rolled to temper  
Thermal conductivity (20°C): 390W/(m°C) 
Elastic modulus: 118000N/m 
Softening temperature: ≥380°C

Sizes and Tolerances (mm)
Thickness Thickness Tolerances Width Width Tolerances
0.01~0.015 ± 0.002 4~250 ± 0.1
> 0.018~0.10 ± 0.002 4~600
> 0.10~0.15 ± 0.005 4~600

Specifications Available (mm)
Thickness Width Temper
0.01~0.015 4~250 O,H
> 0.018~0.10 4~600 O,H
> 0.10~0.15 4~600 O,1/4H,1/2H,H

Carried Standard(Latest)
  Nations Standard No. Standard Name
China GB/T2059--2000 CHINA'S NATIONAL STANDARD
Japan JIS H3100 :2000 COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS
U.S.A ASTM B36/B 36M -01 STANDARD SPECIFICATION FOR BRASS,PLATE,SHEET,STRIP AND ROLLED BAR

12μ M - 100μ M Treated Ra Cu Foil for PCB12μ M - 100μ M Treated Ra Cu Foil for PCB12μ M - 100μ M Treated Ra Cu Foil for PCB12μ M - 100μ M Treated Ra Cu Foil for PCB12μ M - 100μ M Treated Ra Cu Foil for PCB

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