Hte Ra Rolled Annealed Copper Foil for PCB Ccl

Product Details
Customization: Available
Type: Copper Foil
Application: PCB / Fccl / FPC
Manufacturer/Factory, Trading Company
Diamond Member Since 2018

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  • Hte Ra Rolled Annealed Copper Foil for PCB Ccl
  • Hte Ra Rolled Annealed Copper Foil for PCB Ccl
  • Hte Ra Rolled Annealed Copper Foil for PCB Ccl
  • Hte Ra Rolled Annealed Copper Foil for PCB Ccl
  • Hte Ra Rolled Annealed Copper Foil for PCB Ccl
  • Hte Ra Rolled Annealed Copper Foil for PCB Ccl
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Basic Info.

Model NO.
C1100
Shape
Foil
Alloy
Non-alloy
Color
Red
Standard
GB/T
Thickness Range
0.01mm~0.15mm
Widthness
4mm~400mm
Density
8.9g/cm3
Temper
Hard, Soft
Thermal Conductivity
390W
Softening Temperature
≥380ºC
Used
Flexible Copper Clad Laminate(Fccl), Fine Circuit
Transport Package
Base on Customers Requirement
Specification
Customzied
Trademark
Allotech
Origin
China
HS Code
7410110000
Production Capacity
50 Tons Every Month

Product Description

Rolled Copper Foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. 

Base Material: C11000 Copper, Cu > 99.90% 
Thickness Range: 0.0004inch~0.006inch (0.01mm-0.15mm) 
Width Range: 0.16inch~24inch (4mm-600mm) 
Temper: Hard, Quarter Hard, Half Hard, Soft 
Application: Transformer, Copper Flexible Connector, CCL, FCCL, PCB, Geothermal Film, Construction, Decoration etc.

GB ALLOY NO. SIZE (mm)
(ISO) (ASMT) (JIS) (BIS) (DIN)
T2 Cu-ETP C11000 C1100 C101 R-Cu57 Thickness: 0.01-0.15/Max Width: 600
TU2 Cu-OF C10200 C1020 Cu-OFC OF-Cu

 Mechanical Properties
Temper JIS Temper Tensile Strength Rm/N/mm 2 Elongation A50/% Hardness HV
M O 220~275 ≥ 15 50~70
Y4 1/4H 240~300 ≥ 9 65~85
Y H 330~450 - 100~140
T EH 380~510 - -
Note: We can provide products with other properties according to customers` requirements.

Physical Properties 
Density: 8.9g/cm3 
Electrical conductivity (20°C): min 90%IACS for annealed to temper 
                                            min 80%IACS for rolled to temper  
Thermal conductivity (20°C): 390W/(m°C) 
Elastic modulus: 118000N/m 
Softening temperature: ≥380°C

Sizes and Tolerances (mm)
Thickness Thickness Tolerances Width Width Tolerances
0.01~0.015 ± 0.002 4~250 ± 0.1
> 0.018~0.10 ± 0.002 4~600
> 0.10~0.15 ± 0.005 4~600

Specifications Available (mm)
Thickness Width Temper
0.01~0.015 4~250 O,H
> 0.018~0.10 4~600 O,H
> 0.10~0.15 4~600 O,1/4H,1/2H,H

Carried Standard(Latest)
  Nations Standard No. Standard Name
China GB/T2059--2000 CHINA'S NATIONAL STANDARD
Japan JIS H3100 :2000 COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS
U.S.A ASTM B36/B 36M -01 STANDARD SPECIFICATION FOR BRASS,PLATE,SHEET,STRIP AND ROLLED BAR
Hte Ra Rolled Annealed Copper Foil for PCB CclHte Ra Rolled Annealed Copper Foil for PCB CclHte Ra Rolled Annealed Copper Foil for PCB CclHte Ra Rolled Annealed Copper Foil for PCB Ccl

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